During the firing process for the end terminations of our multilayer chip capacitors, we are observing oxidation of the thick film copper material. We are using an inert nitrogen atmosphere in our firing furnaces. What is the possible cause of this oxidation?
There are several possibilities why oxidation is occurring in the process:
All of the above possibilities can be checked by using the proper analytical tools, such as an oxygen ppm analyzer and dew point analyzer at the supply system and the furnace. If the oxygen and dew point are acceptable at the supply system and not acceptable at the inlet of the gas to the furnace, then there is a leak in the piping. If the readings are acceptable at the inlet at the furnace, then an analysis of the furnace atmosphere is warranted. If the furnace atmosphere is poor, then most likely there is a leak in the furnace seals.